Originally published on August 26 2020 The death of Dennard scaling and the rising of the phenomenon of Dark silicon took the IC industry to a crossroads: How to keep improving microprocessors with current power constraints without excessively increasing heat densities on the chip, which could decrease its reliability and useful life? How can we continue to improve single and multithreaded performance without increasing the cooling cost of the processor excessively, and thus continue to bring innovations to environments with significant cooling limitations? In the real world where no financial horsepower is capable of breaking the laws of physics, a fundamental rethink in architectural projects is necessary step to remain capable of bringing innovation to the world, even with such limitations.
AMD Master Plan Pt.2 – Heterogeneous Revolution
AMD Master Plan Pt.2 – Heterogeneous…
AMD Master Plan Pt.2 – Heterogeneous Revolution
Originally published on August 26 2020 The death of Dennard scaling and the rising of the phenomenon of Dark silicon took the IC industry to a crossroads: How to keep improving microprocessors with current power constraints without excessively increasing heat densities on the chip, which could decrease its reliability and useful life? How can we continue to improve single and multithreaded performance without increasing the cooling cost of the processor excessively, and thus continue to bring innovations to environments with significant cooling limitations? In the real world where no financial horsepower is capable of breaking the laws of physics, a fundamental rethink in architectural projects is necessary step to remain capable of bringing innovation to the world, even with such limitations.